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rev. 1.6 2/2010 page 1 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ vmb0004mft features ? 270 vdc ? 33.75 vdc 235 w bus converter ? mil-std-704e/f compliant ? high efficiency (>95%) reduces system power consumption ? high power density (>796 w/in 3 ) reduces power system footprint by >40% ? contains built-in protection features: undervoltage, overvoltage lockout, overcurrent protection, short circuit protection, overtemperature protection. ? provides enable/disable control, internal temperature monitoring ? can be paralleled to create multi-kw arrays typical applications ? high voltage 270 v aircraft distributed power ? 28 vdc mil-cots prmtm interface (mp028f036m21al) ? high density power supplies ? communications systems ? description the mil-cots v ? i chip tm bus converter is a high efficiency (>95%) sine amplitude converter tm (sac tm ) operating from a 240 to 330 vdc primary bus to deliver an isolated 30 ? 41.25 v nominal, unregulated secondary. the VMB0004MFJ and vmb0004mft are provided in a v ? i chip package compatible with standard pick-and-place and surface mount assembly processes. sw1 enable / disable switch f1 v c1 20 f in pc tm -out +out -in +in bcm pr pc vc tm il os sg prm cd -out +out -in +in vc pc tm vtm -out +out -in +in l o a d 240 ?330 vdc (mil-std-704e/f) 30 ?41.25 vdc 26 ?50 vdc 1 ?50 vdc typical application bcm tm bus converter v in = 240 ? 330 v v out = 30 ? 41.25 v ( no load ) p out = 235 w( nom ) k = 1/8
rev. 1.6 2/2010 page 2 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft absolute maximum ratings +in to ?in . . . . . . . . . . . . . . . . . . . . . . . . -1.0 vdc ? +400 vdc pc to ?in . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 vdc ? +20 vdc tm to ?in . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 vdc ? +7 vdc +in/-in to +out/-out . . . . . . . . . . . . . . . . . . . 4242 v (hi pot) +in/-in to +out/-out . . . . . . . . . . . . . . . . . . . 500 v (working) +out to ?out . . . . . . . . . . . . . . . . . . . . . . -1.0 vdc - +60 vdc temperature during reflow . . . . . . . . . . . . . . . . 245c (msl 6) package ordering information part number description VMB0004MFJ -55c ? 125c t j operating, j lead vmb0004mft -55c ? 125c t j operating, through hole control pin specifications see section 5.0 for further application details and guidelines . pc (v ? i chip bcm primary control) the pc pin can enable and disable the bcm. when held below v pc _ dis the bcm shall be disabled. when allowed to float with an impedance to ?in of greater than 50 k the module will start. when connected to another bcm pc pin, the bcms will start simultaneously when enabled. the pc pin is capable of being driven high by either an external logic signal or internal pull up to 5 v (operating). tm (v ? i chip bcm temperature monitor) the tm pin monitors the internal temperature of the bcm within an accuracy of +5/-5c. it has a room temperature setpoint of ~3.0 v and an approximate gain of 10 mv/c. it can source up to 100 a and may also be used as a ?power good? flag to verify that the bcm is operating. -in pc rsv tm +in -out +out -out +out bottom view a b c d e f g h j k l m n p r t 4 3 2 1 a b c d e h j k l m n p r t signal name designation +in a1-e1, a2-e2 ?in l1-t1, l2-t2 tm h1, h2 rsv j1, j2 pc k1, k2 +out a3-d3, a4-d4, j3-m3, j4-m4 ?out e3-h3, e4-h4, n3-t3, n4-t4
rev. 1.6 2/2010 page 3 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft attribute symbol conditions / notes min typ max unit voltage range v in 240 270 330 vdc dv/dt dv in /dt 1 v/s quiescent power p q pc connected to -in 395 410 mw no load power dissipation p nl v in = 240 to 330 v 10 w inrush current peak i inr _ p v in = 330 v c out = 100 f, 2.5 4 a p out = 235 w dc input current i in _ dc p out = 235 w 0.95 a k factor ( v out ) k 1/8 v in output power (average) p out v in = 270 v dc ; see figure 14 235 w v in = 240 ? 330 v dc ; see figure 14 215 output power (peak) p out _ p v in = 270 v dc 352.5 w average p out < = 235 w, tpeak < 5 ms output voltage v out section 3.0 no load 30 41.25 v output current (average) i out pout < = 235 w 7.3 a efficiency (ambient) v in = 270 v, p out = 235 w 94.1 95.4 % v in = 240 v to 330 v, p out = 235 w 94 95.2 efficiency (hot) v in = 270 v, t j = 100 c,p out = 235 w 93.7 94.7 % minimum efficiency 60 w < p out < 235 w max 90 % (over load range) output resistance (ambient) r out t j = 25 c 100 130 170 m output resistance (hot) r out t j = 125 c 130 180 210 m output resistance (cold) r out t j = -55 c 40 105 160 m load capacitance c out 100 uf switching frequency f sw 1.56 1.64 1.72 mhz ripple frequency f sw _ rp 3.12 3.28 3.44 mhz output voltage ripple v out _ pp c out = 0 f, p out = 235 w, v in = 270 v, 160 400 mv section 8.0 v in to v out (application of v in )t on 1 v in = 270 v, c pc = 0; see figure 17 460 540 620 ms pc pc voltage (operating) v pc 4.7 5 5.3 v pc voltage (enable) v pc _ en 2 2.5 3 v pc voltage (disable) v pc _ dis 1.95 v pc source current (startup) i pc _ en 50 100 300 ua pc source current (operating) i pc _ op 2 3.5 5 ma pc internal resistance r pc _ snk internal pull down resistor 50 150 400 k pc capacitance (internal) c pc _ int section 5.0 1000 pf pc capacitance (external) c pc _ ext external capacitance delays pc enable time 1000 pf external pc resistance r pc connected to ?v in 50 k pc external toggle rate f pc _ tog 1 hz pc to v out with pc released ton2 v in = 270 v, pre-applied 50 100 150 s c pc = 0, c out = 0; see figure 17 pc to v out , disable pc t pc _ dis v in = 270 v, pre-applied 410s c pc = 0, c out = 0; see figure 17 1.0 electrical characteristics specifications apply over all line and load conditions unless otherwise noted; boldface specifications apply over the temperature range of --55c < t j < 125c (m-grade) ; all other specifications are at t j = 25oc unless otherwise noted
rev. 1.6 2/2010 page 4 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 1.0 electrical characteristics (cont.) specifications apply over all line and load conditions unless otherwise noted; boldface specifications apply over the temperature range of --55c < t j < 125c (m-grade) ; all other specifications are at t j = 25oc unless otherwise noted attribute symbol conditions / notes min typ max unit tm tm accuracy a ctm -5 +5 oc tm gain a tm 10 mv/c tm source current i tm 100 ua tm internal resistance r tm _ snk 25 40 50 k external tm capacitance c tm 50 pf tm voltage ripple v tm _ pp c tm = 0f, v in = 330 v, p out = 235 w 200 400 500 mv protection negative going ovlo v in _ ovlo - 350 365 380 v positive going ovlo v in _ ovlo + 355 372 385 v negative going uvlo v in _ uvlo - 90 115 125 v positive going uvlo v in _ uvlo + 100 125 135 v output overcurrent trip i ocp v in = 270 v, 25c 9 12 14 a short circuit protection i scp 14 a trip current short circuit protection t scp 0.8 1 1.2 us response time thermal shutdown t j _ otp 125 130 135 c junction setpoint general specification isolation voltage (hi-pot) v hipot 4242 v working voltage (in ? out) v working 500 v isolation capacitance c in _ out unpowered unit 500 660 800 pf isolation resistance r in _ out 10 m mtbf mil hdbk 217f, 25 c, gb 4.2 mhrs agency approvals/standards ctuvus ce mark
rev. 1.6 2/2010 page 5 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 1.1 application characteristics all specifications are at t j = 25oc unless otherwise noted. see associated figures for general trend data. attribute symbol conditions / notes typ unit no load power p nl v in = 270 v, pc enabled; see figure 1 5.5 w inrush current peak i nr _ p c out = 100 f, p out = 235 w 2.5 a efficiency (ambient) v in = 270 v, p out = 235 w 95.4 % efficiency (hot ? 100c) v in = 270 v, p out = 235 w 94.7 % output resistance (-55c) r out v in = 270 v 105 m output resistance (25c) r out v in = 270 v 130 m output resistance (120c) r out v in = 270 v 180 m output voltage ripple v out _ pp c out = 0 uf, p out = 235 w @ v in = 270, 160 mv v in = 270 v v out transient (positive) v out _ tran + i out _ step = 0 to 7.3 a , 1.4 v i slew >10 a/us; see figure 11 v out transient (negative) v out _ tran - i out _ step = 7.3 a to 0 a, 1.3 v i slew > 10 a/us; see figure 12 undervoltage lockout t uvlo 150 us response time output overcurrent t ocp 9< i ocp < 14 a 5 ms response time overvoltage lockout t ovlo 120 s response time tm voltage (ambient) v tm _ amb t j ? 27c 3 v
rev. 1.6 2/2010 page 6 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 0 1 2 3 4 5 6 7 8 9 230 250 270 290 310 330 no load power dissipation vs line input voltage (v) no load power dissipation (w) -55? 25? 100? t : case 94.2 94.4 94.6 94.8 95.0 95.2 95.4 95.6 95.8 96.0 -100 -50 0 50 100 150 case temperature (c) efficiency (%) full load efficiency vs. case temperature 240 v 270 v 330 v v : in 65 70 75 80 85 90 95 012345678 5 7 9 11 13 15 efficiency & power dissipation -55? case output current (a) efficiency (%) power dissipation (w) 240 v 270 v 330 v v : in 240 v 270 v 330 v p d 80 82 84 86 88 90 92 94 96 98 012345678 3 5 7 9 11 13 15 efficiency & power dissipation vs. 25c case output current (a) efficiency (%) power dissipation (w) 240 v 270 v 330 v v : in 240 v 270 v 330 v p d 80 82 84 86 88 90 92 94 96 98 012345678 2.5 4.5 6.5 8.5 10.5 12.5 14.5 16.5 efficiency & power disspiation 100c case output current (a) efficiency (%) 240 v 270 v 330 v v : in 240 v 270 v 330 v power dissipation (w) p d 90 100 11 0 120 130 140 150 160 170 180 190 -80 -60 -40 -20 0 20 40 60 80 100 120 r out vs. case temperature case temperature (c) rout (m) i : out 0.73 a 7.3 a figure 1 ? no load power dissipation vs. v in ; t case figure 2 ? full load efficiency vs. temperature; v in figure 3 ? efficiency and power dissipation at -55c (case); v in figure 4 ? efficiency and power dissipation at 25c (case); v in figure 5 ? efficiency and power dissipation at 100c (case); v in figure 6 ? r out vs. temperature vs. i out
rev. 1.6 2/2010 page 7 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 0 20 40 60 80 100 120 140 160 180 012345678 ripple vs. load load current (a) ripple (mv pk-pk) vpk-pk (mv) figure 7 ? vripple vs. i out ; 270 vin, no external capacitance figure 8 ? pc to v out startup waveform figure 9 ? v in to v out startup waveform figure 10 ? output voltage and input current ripple, 270 vin, 235 w no c out figure 11 ? positive load transient (0 ? 7.3 a) figure 12 ? negative load transient (7.3 a ? 0 a)
rev. 1.6 2/2010 page 8 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft figure 13 ? pc disable waveform, 270 v in , 100 f c out full load 0 50 100 150 200 250 300 350 400 29.00 31.00 33.00 35.00 37.00 39.00 41.00 output power (w) steady state 5 ms 352.5 w ave safe operating area figure 14 ? safe operating area vs. v out 0 20 40 60 80 100 120 125 150 200 250 280 300 330 350 400 ovp normal operating range 50 ms operation full current mil-std-704f envelope of normal v transients for 270 vdc systems 50 ms full current 1% duty 50% rated current v dc ms uvl figure 15 ? envelope of normal voltage transient for 270 volts dc system.
rev. 1.6 2/2010 page 9 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft attribute symbol conditions / notes min typ max unit length l 32.4 / 1.27 32.5 / 1.28 32.6 / 1.29 mm/in width w 21.7 / 0.85 22.0 / 0.87 22.3 / 0.89 mm/in height h 6.48 / 0.255 6.73 / 0.265 6.98 / 0.275 mm/in volume vol no heatsink 4.81 / 0.295 cm 3 /in 3 footprint f no heatsink 7.3 / 1.1 cm 2 /in 2 power density p d no heatsink 796 w/in 3 49 w/cm 3 weight w 0.5/14 oz/g lead finish nickel (0.51-2.03 m) palladium (0.02-0.15 m) m gold (0.003-0.05 m) operating temperature t j -55 125 c storage temperature t st -65 125 c thermal capacity 9 ws/c peak compressive force no j-lead support 5 6 lbs applied to case (z-axis) esd rating esd hbm human body model [a] 1500 v dc esd mm machine model [b] 400 peak temperature during reflow msl 5 225 c msl 6 245 c peak time above 183c 150 s peak heating rate during reflow 1.5 3 c/s peak cooling rate post reflow 1.5 6 c/s thermal impedance ? jc min board heatsinking 1.1 1.5 c/w 2.0 package/mechanical specifications all specifications are at t j = 25oc unless otherwise noted. see associated figures for general trend data. [a] jedec jesd 22-a114c.01 [b] jeded jesd 22-a115-a
rev. 1.6 2/2010 page 10 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft top view ( component side ) bottom view inch mm notes: 1. dimensions are . 2. unless otherwise specified, tolerances are: .x / [.xx] = +/-0.25 / [.01]; .xx / [.xxx] = +/-0.13 / [.005] 3. product marking on top surface dxf and pdf files are available on vicorpower.com 2.1 mechanical drawing recommended land pattern ( component side shown ) inch mm notes: 1. dimensions are . 2. unless otherwise specified, tolerances are: .x / [.xx] = +/-0.25 / [.01]; .xx / [.xxx] = +/-0.13 / [.005] 3. product marking on top surface dxf and pdf files are available on vicorpower.com 2.2 recommended land pattern
rev. 1.6 2/2010 page 11 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft top view ( component side ) bottom view notes: 1. dimensions are 2. unless otherwise specified tolerances are: x.x [x.xx] = ?.25 [0.01]; x.xx [x.xxx] = ?.13 [0.005] 3. rohs compliant per cst-0001 latest revision dxf and pdf files are available on vicorpower.com inch (mm) . 2.3 mechanical drawing notes: 1. dimensions are 2. unless otherwise specified tolerances are: x.x [x.xx] = ?.25 [0.01]; x.xx [x.xxx] = ?.13 [0.005] 3. rohs compliant per cst-0001 latest revision dxf and pdf files are available on vicorpower.com inch (mm) . recommended hole pattern ( component side shown ) 2.4 recommended land pattern
rev. 1.6 2/2010 page 12 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft recommended land pattern (no grounding clips) top side shown recommended land pattern (with grounding clips) top side shown notes: 1. maintain 3.50 [0.138] dia. keep-out zone free of copper, all pcb layers. 2. (a) minimum recommended pitch is 39.50 [1.555], this provides 7.00 [0.275] component edge-to-edge spacing, and 0.50 [0.020] clearance between vicor heat sinks. (b) minimum recommended pitch is 41.00 [1.614], this provides 8.50 [0.334] component edge-to-edge spacing, and 2.00 [0.079] clearance between vicor heat sinks. 3. v?i chip land pattern shown for reference only; actual land pattern may differ. dimensions from edges of land pattern to push-pin holes will be the same for all full size v?ichip products. 4. unless otherwise specified: dimensions are mm [inch]. tolerances are: x.x [x.xx] = 0.3 [0.01] x.xx [x.xxx] = 0.13 [0.005] 5. plated through holes for grounding clips (33855) shown for reference. heatsink orientation and device pitch will dictate final grounding solution. 2.5 recommended land pattern for push pin heat sink
rev. 1.6 2/2010 page 13 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 3.0 power, voltage, efficiency relationships because of the high frequency, fully resonant sac topology, power dissipation and overall conversion efficiency of bcm converters can be estimated as shown below. key relationships to be considered are the following: 1. transfer function a. no load condition v out = v in ? k eq. 1 where k (transformer turns ratio) is constant for each part number b. loaded condition v out = vin ? k ? i out ? r out eq. 2 2. dissipated power the two main terms of power losses in the bcm module are: - no load power dissipation (p nl ) defined as the power used to power up the module with an enabled power train at no load. - resistive loss (r out ) refers to the power loss across the bcm modeled as pure resistive impedance. p dissipated ~ p nl + p r out eq. 3 ~ therefore, with reference to the diagram shown in figure 16 p out = p in ?p dissipated = p in ?p nl ?p r out eq. 4 notice that r out is temperature and input voltage dependent and p nl is temperature dependent (see figure 16). input power output power p nl p r out figure 16 ? power transfer diagram the above relations can be combined to calculate the overall module efficiency: = p out = p in ?p nl ?p r out = p in p in v in ? i in ?p nl ?(i out ) 2 ? r out =1 ? ( p nl + (i out ) 2 ? r out ) v in ? i in v in ? i in eq. 5
rev. 1.6 2/2010 page 14 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 4.0 operating 12 3 4 5 6 v uvlo + pc 5 v 3 v ll ? k a: t on1 b: t ovlo* c: max recovery time d:t uvlo e: t on2 f: t ocp g: t pcCdis h: t ssp** 1: controller start 2: controller turn off 3: pc release 4: pc pulled low 5: pc released on output sc 6: sc removed vout tm 3 v @ 27c 0.4 v v in 3 v 5 v 2.5 v 500ms before retrial v uvlo C a b e h i ssp i out i ocp g f d c v ovlo + v ovlo C v ovlo + nl notes: C timing and voltage is not to scale C error pulse width is load dependent *min value switching off **from detection of error to power train shutdown c figure 17 ? timing diagram
rev. 1.6 2/2010 page 15 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 5.0 using the control signals tm and pc the pc control pin can be used to accomplish the following functions: ? delayed start: at start-up, pc pin will source a constant 100 ua current to the internal rc network. adding an external capacitor will allow further delay in reaching the 2.5 v threshold for module start. ? synchronized start up: in a parallel module array, pc pins shall be connected in order to ensure synchronous start of all the units. while every controller has a calibrated 2.5 v reference on pc comparator, many factors might cause different timing in turning on the 100 ua current source on each module, i.e.: ? different v in slew rate ? statistical component value distribution by connecting all pc pins, the charging transient will be shared and all the modules will be enabled synchronously. ? auxiliary voltage source: once enabled in regular operational conditions (no fault), each bcm pc provides a regulated 5 v, 2 ma voltage source. ? output disable: pc pin can be actively pulled down in order to disable module operations. pull down impedance shall be lower than 850 and toggle rate lower than 1 hz. ? fault detection flag: the pc 5 v voltage source is internally turned off as soon as a fault is detected. after a minimum disable time, the module tries to re-start, and pc voltage is re-enabled. for system monitoring purposes (microcontroller interface) faults are detected on falling edges of pc signal. it is important to notice that pc doesn?t have current sink capability (only 150 k typical pull down is present), therefore, in an array, pc line will not be capable of disabling all the modules if a fault occurs on one of them. the temperature monitor (tm) pin provides a voltage propor- tional to the absolute temperature of the converter control ic. it can be used to accomplish the following functions: ? monitor the control ic temperature: the temperature in kelvin is equal to the voltage on the tm pin scaled by x100. (i.e. 3.0 v = 300 k = 27oc). it is important to remember that v ? i chips are multi-chip modules, whose temperature distribution greatly vary for each part number as well with input/output conditions, thermal management and environmental conditions. therefore, tm cannot be used to thermally protect the system. ? fault detection flag: the tm voltage source is internally turned off as soon as a fault is detected. after a minimum disable time, the module tries to re-start, and tm voltage is re-enabled. 6.0 fuse selection v ? i chips are not internally fused in order to provide flexibility in configuring power systems. input line fusing of v ? i chips is recommended at system level, in order to provide thermal protection in case of catastrophic failure. the fuse shall be selected by closely matching system requirements with the following characteristics: ? current rating (usually greater than maximum bcm current) ? maximum voltage rating (usually greater than the maximum possible input voltage) ? ambient temperature ? nominal melting i 2 t ? recommended fuse: 2.5 a bussmann pc-tron or soc type 36cfa.
rev. 1.6 2/2010 page 16 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 7.0 current sharing the sac topology bases its performance on efficient transfer of energy through a transformer, without the need of closed loop control. for this reason, the transfer characteristic can be approximated by an ideal transformer with some resistive drop and positive temperature coefficient. this type of characteristic is close to the impedance characteristic of a dc power distribution system, both in behavior (ac dynamic) and absolute value (dc dynamic). when connected in an array (with same k factor), the bcm module will inherently share the load current with parallel units, according to the equivalent impedance divider that the system implements from the power source to the point of load. it is important to notice that, when successfully started, bcms are capable of bidirectional operations (reverse power transfer is enabled if the bcm input falls within its operating range and the bcm is otherwise enabled). in parallel arrays, because of the resistive behavior, circulating currents are never experienced (energy conservation law). general recommendations to achieve matched array impedances are (see also an016 for further details): ? to dedicate common copper planes within the pcb to deliver and return the current to the modules ? to make the pcb layout as symmetric as possible ? to apply same input/output filters (if present) to each unit figure 18 ? bcm array
rev. 1.6 2/2010 page 17 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft 8.0 input and output filter design a major advantage of sac systems versus conventional pwm converters is that the transformers do not require large functional filters. the resonant lc tank, operated at extreme high frequency, is amplitude modulated as a function of input voltage and output current, and efficiently transfers charge through the isolation transformer. a small amount of capacitance, embedded in the input and output stages of the module, is sufficient for full functionality and is key to achieve power density. this paradigm shift requires system design to carefully evaluate external filters in order to: 1. guarantee low source impedance: to take full advantage of the bcm dynamic response, the impedance presented to its input terminals must be low from dc to approximately 5 mhz. the connection of the v ? i chip to its power source should be implemented with minimal distribution inductance. if the interconnect inductance exceeds 100 nh, the input should be bypassed with a rc damper to retain low source impedance and stable operation. with an interconnect inductance of 200 nh, the rc damper may be as high as 1 f in series with 0.3 . a single electrolytic or equivalent low-q capacitor may be used in place of the series rc bypass. 2. further reduce input and/or output voltage ripple without sacrificing dynamic response: given the wide bandwidth of the bcm, the source response is generally the limiting factor in the overall system response. anomalies in the response of the source will appear at the output of the bcm multiplied by its k factor. this is illustrated in figures 11 and 12. 3. protect the module from overvoltage transients imposed by the system that would exceed maximum ratings and cause failures: the v ? i chip input/output voltage ranges shall not be exceeded. an internal overvoltage lockout function prevents operation outside of the normal operating input range. even during this condition, the powertrain is exposed to the applied voltage and power mosfets must withstand it. a criterion for protection is the maximum amount of energy that the input or output switches can tolerate if avalanched. total load capacitance at the output of the bcm shall not exceed the specified maximum. owing to the wide bandwidth and low output impedance of the bcm, low frequency bypass capacitance and significant energy storage may be more densely and efficiently provided by adding capacitance at the input of the bcm. at frequencies <500 khz the bcm appears as an impedance of r out between the source and load. within this frequency range capacitance at the input appears as effective capacitance on the output per the relationship defined in eq. 5. c out = c in eq. 6 k 2 this enables a reduction in the size and number of capacitors used in a typical system.
rev. 1.6 2/2010 page 18 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft +vout -vout modulator +vin pc enable -vin 2.5 v 100 ? 5 v 2 ma 150 k 1000 pf 18.5 v gate drive supply 2.5 v primary current sensing start up & fault logic one shot delay 320/540 ms wake-up power and logic pc pull-up & source primary stage & resonant tank 1.5 k adaptive soft start fast current limit slow current limit vref over-current protection vref (125?) tm over temperature protection uvlo ovlo v in temperature dependent voltage source c out ls1 ls2 q1 q2 q3 q4 q5 q6 q7 q8 synchronous rectification lp1 lp2 power transformer cr lr cr lr c1 c2 c3 c4 primary gate drive 2.50 v cs2 secondary gate drive 40 k
rev. 1.6 2/2010 page 19 of 19 v?i chip inc. (a vicor company) 25 frontage rd. andover, ma 01810 800-735-6200 vicorpower.com preliminary datasheet VMB0004MFJ - vmb0004mft vicor?s comprehensive line of power solutions includes high density ac-dc and dc-dc modules and accessory components, fully configurable ac-dc and dc-dc power supplies, and complete custom power systems. information furnished by vicor is believed to be accurate and reliable. however, no responsibility is assumed by vicor for its use. vicor components are not designed to be used in applications, such as life support systems, wherein a failure or malfunction could result in injury or death. all sales are subject to vicor?s terms and conditions of sale, which are available upon request. specifications are subject to change without notice. intellectual property notice vicor and its subsidiaries own intellectual property (including issued u.s. and foreign patents and pending patent applications) relating to the products described in this data sheet. interested parties should contact vicor's intel- lectual property department. the products described on this data sheet are protected by the following u.s. patents numbers: 5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917; 7,166,898; 7,187,263; 7,361,844; d496,906; d505,114; d506,438; d509,472; and for use under 6,975,098 and 6,984,965 warranty vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in normal use and service. this warranty does not extend to products subjected to misuse, accident, or improper applica- tion or maintenance. vicor shall not be liable for collateral or consequential damage. this warranty is extended to the original purchaser only. except for the foregoing express warranty, vicor makes no warranty, express or implied, including, but not limited to, the warranty of merchantability or fitness for a particular purpose. vicor will repair or replace defective products in accordance with its own best judgement. for service under this war- ranty, the buyer must contact vicor to obtain a return material authorization (rma) number and shipping instructions. products returned without prior authorization will be returned to the buyer. the buyer will pay all charges incurred in re- turning the product to the factory. vicor will pay all reshipment charges if the product was defective within the terms of this warranty. information published by vicor has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. vicor reserves the right to make changes to any products without further notice to improve reliability, function, or design. vicor does not assume any liability arising out of the application or use of any product or circuit; neither does it convey any license under its patent rights nor the rights of others. vicor general policy does not recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten life or injury. per vicor terms and conditions of sale, the user of vicor components in life support applications assumes all risks of such use and indemnifies vicor against all damages.

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